Acquisition of Advanced Low-Pressure Hot Melt Injection Machine

Kinsun recently announced the acquisition and installation of a new low-pressure hot melt injection machine, designed to enhance production efficiency and product quality. This advanced machine melts solid hot melt adhesive granules into a liquid using electric heat. Controlled by computer, the liquid adhesive is injected through a plunger system into embedded electronic components. Upon cooling, the adhesive forms a smooth, protective encapsulation. This process offers precise low-pressure control, rapid cooling, and high efficiency without damaging sensitive electronic components.

Applications of this technology are extensive, including encapsulation for sensors and waterproof components in automotive, electronics, and medical industries, as well as partial protective encapsulation of PCBs. Compared to traditional epoxy resin dispensing machine, this technology is faster, more space-efficient, precise, and shock-resistant, establishing a new standard in encapsulation materials.

"This new low-pressure hot melt injection machine represents a significant step forward in enhancing our production capabilities and product quality. We look forward to delivering greater value to our customers." said Wang Yong-Hua, the assistant manager of production of Kinsun.

For more information about the new equipment or to discuss potential applications, please contact the Kinsun sales team.